Effect of Phase Evolution on Inhomogeneous Deformation and Fracture Behavior in Sn-Bi Solder Alloys-Reference-Cited by-同舟云学术

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Effect of Phase Evolution on Inhomogeneous Deformation and Fracture Behavior in Sn-Bi Solder Alloys

Published:2024-04-17 Issue: Volume: Page:161-162
ISSN:
Container-title:2024 International Conference on Electronics Packaging (ICEP)
language:
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Author:

Liang Shuibao¹,Li Wangyun²,Jiang Han³,Guo Zhihao¹,Zhong Zhihong¹

Affiliation:

1. School of Materials Science and Engineering, Hefei University of Technology,Hefei,China,230009

2. School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology,Guilin,China,541004

3. School of Integrated-Circuits, Anhui University,Hefei,China,230601

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10535428/10535429/10535626.pdf?arnumber=10535626

Reference4 articles.

1. A review: On the development of low melting temperature Pb-free solders

2. Effect of isothermal aging on mechanical properties and strain rate sensitivity of the eutectic Sn-58Bi solder alloy

3. Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradient

4. Multi-scale modeling of microstructure dependent intergranular brittle fracture using a quantitative phase-field based method

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