Dissolution Behavior of Cu-0.1wt.% Fe C19210 in Molten Sn & SAC305 Solders
Author:
Affiliation:
1. National Taiwan University of Science and Technology,Department of Materials Science and Engineering,Taipei,Taiwan,R. O. C.,10672
Funder
National Science Council of Taiwan (ROC)
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10535428/10535429/10535685.pdf?arnumber=10535685
Reference8 articles.
1. Twin Roll Casting of Copper Alloy C19210 Using Commercial Scale Machine
2. A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates
3. Optimal Hot-Dipped Tinning Process Routine for the Fabrication of Solderable Sn Coatings on Circuit Lead Frames
4. Effect of Fe addition to Sn-3Ag-0.5Cu solder on interfacial reactions during aging
5. Effects of minor Fe, Co, and Ni additions on the reaction between SnAgCu solder and Cu
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