The Strategy on Artificial Neural Networks for Predicting Advanced Packaging Reliability Under Small Dataset-Reference-Cited by-同舟云学术

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The Strategy on Artificial Neural Networks for Predicting Advanced Packaging Reliability Under Small Dataset

Published:2024-04-17 Issue: Volume:41 Page:183-184
ISSN:
Container-title:2024 International Conference on Electronics Packaging (ICEP)
language:
Short-container-title:

Author:

Su Qinghua¹,Yuan Cadmus²,Chiang K.N.¹

Affiliation:

1. National Tsing Hua University,Advanced Microsystem Packaging and Nano-Mechanics Research Lab,Taiwan Dept. of Power Mechanical Engineering,Hsinchu,Taiwan, R.O.C.,300

2. Feng Chia University,Dept. of Mechanical and Computer-Aided Engineering,Taichung,Taiwan, R.O.C.,407

Funder

Semiconductor Research Cooperation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10535428/10535429/10535576.pdf?arnumber=10535576

Reference4 articles.

1. Reliability assessment using modified energy based model for WLCSP solder joints

2. Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning Algorithms

3. Introduction to artificial neural network (ANN) methods: what they are and how to use them;Zupan;Acta Chimica Slovenica,1994

4. A dynamic ensemble learning algorithm for neural networks

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