Characterizations for eWLB (Embedded Wafer Level Ball Grid Array) Antenna in Molded Package Integrations in 77GHz Automotive Applications-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Characterizations for eWLB (Embedded Wafer Level Ball Grid Array) Antenna in Molded Package Integrations in 77GHz Automotive Applications

Published:2023-09-11 Issue: Volume: Page:1-5
ISSN:
Container-title:2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
language:
Short-container-title:

Author:

Hsieh Ming-Che¹,Zhang Frank²,Zhu Forest³,Liu Kang³,Chua Linda⁴,Lin Yaojian⁴,Damalerio Joel⁵,Goh Hin Hwa⁵,Chan Kai Chong⁵,Chen Zihao⁶

Affiliation:

1. Field Applications Engineering JCET Group Co., Ltd.,Singapore

2. Chief Executive Officer Andar Technologies Co., Ltd.,Hangzhou,China

3. Andar Technologies Co., Ltd.,Research & Design Dept.,Hangzhou,China

4. R&D Engineering JCET Group Co., Ltd.,Singapore

5. Process Engineering JCET Group Co., Ltd.,Singapore

6. College of Electronics and Information Engineering, Harbin Institute of Technology,Shenzhen,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10418252/10418244/10418447.pdf?arnumber=10418447

Reference6 articles.

1. An Embedded Device Technology Based on a Molded Reconfigured Wafer

2. 77GHz automotive RADAR in eWLB package: From consumer to automotive packaging

3. Thermal and electrical characterization of eWLB (embedded Wafer Level BGA)

4. Advanced eWLB/FO-WLP (embedded Wafer Level Ball Grid Array/FanOut-Wafer Level Package) for High Frequency Applications;Yoon;Semicon Korea,2017

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP