Application of Machine Learning Methods for Process Optimization in Electronic Packaging Processes-Reference-Cited by-同舟云学术

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Application of Machine Learning Methods for Process Optimization in Electronic Packaging Processes

Published:2023-09-11 Issue: Volume:139 Page:1-6
ISSN:
Container-title:2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
language:
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Author:

Niegisch Corinna¹,Haag Sabine T.¹,Braun Tanja²,Hülck Ole²,Schneider-Ramelow Martin³

Affiliation:

1. Robert Bosch GmbH,Corporate Sector Research and Advance Engineering,Renningen,Germany

2. Fraunhofer IZM,Departement System Integration and Interconnection Technologies,Berlin,Germany

3. Technical University Berlin,Faculty IV Electrical Engineering and Computer Science,Berlin,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10418252/10418244/10418387.pdf?arnumber=10418387

Reference18 articles.

1. Evaluation of the Dielectric Cure Monitoring of Epoxy Molding Compound in Transfer Molding Process for Electronic Packages;Kaya

2. Constraints on monitoring resin flow in the resin transfer molding (RTM) process by using thermocouple sensors

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