Author:
Inoue F.,Peng L.,Phommahaxay A.,Kim S.-W.,De Vos J.,Sleeckx E.,Miller A.,Beyer G.,Beyne E.
Cited by
4 articles.
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1. Plasma Chamber Environment Control to Enhance Bonding Strength for Wafer-to-Wafer Bonding Processing;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
2. Process and Design Optimization for Hybrid Cu Bonding Void;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
3. Direct Bonding of low Temperature Heterogeneous Dielectrics;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05
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