Pb-free solders and other joining materials for potential replacement of high-Pb hierarchical solders
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8308483/8318728/08319020.pdf?arnumber=8319020
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2. Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding;Materials;2021-01-11
3. The Coming Targets of Research Activities of Electronics Jisso Technology from the View of Material Development, Saving and Pollution Free Engineering;Journal of The Japan Institute of Electronics Packaging;2019-01-01
4. Die-Attach Materials for Extreme Conditions and Harsh Environments;Die-Attach Materials for High Temperature Applications in Microelectronics Packaging;2019
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