The "first and euRopEAn siC eighT Inches pilOt liNe": a project, called REACTION, that will boost key SiC Technologies upgrading (developments) in Europe, unleashing Applications in the Automotive Power Electronics Sector

Author:

Messina Angelo Alberto,Imbruglia Antonio,Calabretta Michele,Vinciguerra Vincenzo,Moise Calin Constantin,Sitta Alessandro,Enachescu Marius,Roccaforte Fabrizio

Publisher

IEEE

Cited by 18 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Implementation and Comparison of SiC and GaN switches for EV Fast Recharging Systems;2023 Asia Meeting on Environment and Electrical Engineering (EEE-AM);2023-11-13

2. Determination of the Equivalent Thickness of a Taiko Wafer Using ANSYS Finite Element Analysis;Applied Sciences;2023-07-24

3. Investigating the Occurrence of Bifurcation in Large Metalized Wafers using ANSYS Layered Shell Elements;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

4. Models of Bifurcation and Gravity Induced Deflection in Wide Band Gap 4H-SiC Semiconductor Wafers;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

5. Experimental-numerical characterization of maximum current capability in Si-based surface mounted power devices;Microelectronics Reliability;2022-11

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