A Differentially Fed Dual-polarized Antenna-in-Package Based on Stacked TGV Interposers for 5G Application
Author:
Affiliation:
1. Shenzhen Graduate School of Peking University,School of Electronic and Computer Engineering,Shenzhen,China,518055
2. Xiamen University,Department of Mechanical & Electrical Engineering,Xiamen,China,361005
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9795348/9795361/09795370.pdf?arnumber=9795370
Reference5 articles.
1. Investigation of low-cost through glass vias formation on borosilicate glass by picosecond laser-induced selective etching
2. A low-cost dual-polarized 28 GHz phased array antenna for 5G communications
3. 2x64 Dual- Polarized Dual-Beam Single-Aperture 28 GHz Phased Array with High Cross-Polarization Rejection for 5G Polarization MIMO;nafe;IEEE MTT-S Int Microwave Symp (IMS),2019
4. Antenna-in-Package Design Considerations for Ka-Band 5G Communication Applications
5. Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias
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