Development and Characterization of Sn99Ag0.3Cu0.7 -(ZrO2/CuO/TiO<sub>2</sub>) Nano-Composite Solder Alloys-Reference-Cited by-同舟云学术

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Development and Characterization of Sn99Ag0.3Cu0.7 -(ZrO2/CuO/TiO₂) Nano-Composite Solder Alloys

Published:2024-01-29 Issue: Volume:53 Page:1-8
ISSN:
Container-title:2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific)
language:
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Author:

Illés Balázs¹,Choi Halim¹,Illés Balázs²,Skwarek Agata²

Affiliation:

1. Budapest University of Technology and Economics,Faculty of Electrical Engineering and Informatics,Department of Electronics Technology,Budapest,Hungary

2. Łukasiewicz Research Network - Institute of Microelectronics and Photonics, LTCC Technology Research Group,Kraków,Poland

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10436504/10436439/10436525.pdf?arnumber=10436525

Reference14 articles.

1. Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders

2. Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging

3. Microstructure Influence of SACX0307-TiO2 Composite Solder Joints on Thermal Properties of Power LED Assemblies

4. Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder

5. Influence of TiO2 nanoparticles on thermal property, wettability and interfacial reaction in Sn–3.0Ag–0.5Cu–xTiO2 composite solder

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