Author:
Kuo Hung-Chun,Chu Fu-Chen,Wang Chen-Chao,Hung Chih-Pin
Cited by
3 articles.
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1. Characteristic Impedance Analysis and 2X-Thru De-embedding of Fine Line;2023 International Conference on Microwave and Millimeter Wave Technology (ICMMT);2023-05-14
2. Advanced Flip Chip Packaging;Springer Series in Reliability Engineering;2023
3. Analysis of Warpage and Stress Behavior in a Fine Pitch Multi-Chip Interconnection with Ultrafine-Line Organic Substrate (2.1D);2018 IEEE 68th Electronic Components and Technology Conference (ECTC);2018-05