Elastic strain engineering for ultralow mechanical dissipation

Author:

Ghadimi A. H.1ORCID,Fedorov S. A.1ORCID,Engelsen N. J.1ORCID,Bereyhi M. J.1,Schilling R.1ORCID,Wilson D. J.2,Kippenberg T. J.1ORCID

Affiliation:

1. Institute of Physics, École Polytechnique Fédérale de Lausanne, 1015 Lausanne, Switzerland.

2. IBM Research–Zurich, 8803 Rüschlikon, Switzerland.

Abstract

Better performance under stress Engineering stress or strain into materials can improve their performance. Adding mechanical stress to silicon chips, for instance, produces transistors with enhanced electron mobility. Ghadimi et al. explore the possibility of enhancing the vibrational properties of a micromechanical oscillator by engineering stress within the structure (see the Perspective by Eichler). By careful design of the micromechanical oscillator, and by building in associated stresses, exceptional vibrational properties can be produced. Such enhanced oscillators could be used as exquisite force sensors. Science , this issue p. 764 ; see also p. 706

Funder

European Commission

European Research Council

Swiss National Science Foundation

Horizon 2020

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

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