Design and Fabrication of Topologically Complex, Three-Dimensional Microstructures-Reference-Cited by-同舟云学术

Design and Fabrication of Topologically Complex, Three-Dimensional Microstructures

Published:1998-06-26 Issue:5372 Volume:280 Page:2089-2091
ISSN:0036-8075
Container-title:Science
language:en
Short-container-title:Science

Author:

Jackman Rebecca J.¹²,Brittain Scott T.¹²,Adams Allan¹²,Prentiss Mara G.¹²,Whitesides George M.¹²

Affiliation:

1. R. J. Jackman, S. T. Brittain, G. M. Whitesides, Department of Chemistry and Chemical Biology, Harvard University, 12 Oxford Street, Cambridge, MA 02138, USA.

2. A. Adams and M. G. Prentiss, Department of Physics, Harvard University, 9 Oxford Street, Cambridge, MA 02138, USA.

Abstract

Two concepts for use in the fabrication of three-dimensional (3D) microstructures with complex topologies are described. Both routes begin with a two-dimensional (2D) pattern and transform it into a 3D microstructure. The concepts are illustrated by use of soft lithographic techniques to transfer 2D patterns to cylindrical (pseudo-3D) substrates. Subsequent steps—application of uniaxial strain, connection of patterns on intersecting surfaces—transform these patterns into free-standing, 3D, noncylindrically symmetrical microstructures. Microelectrodeposition provides an additive method that strengthens thin metal designs produced by patterning, welds nonconnected structures, and enables the high-strain deformations required in one method to be carried out successfully.

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

Reference29 articles.

1. K. Petersen Proc. IEEE 70 420 (1982).

2. Kovacs G. T. A., Petersen K., Albin M., Anal. Chem.68, 407A (1996).

3. L. T. Romankiw ECS Proc. Symp. Mag. Materials Processes and Devices IV Applications to Microelectromechanical Systems (MEMS) L. T. Romankiw and D. A. Herman Jr. Eds. (USA Electrochemical Society Pennington NJ 1996) pp. 253–272.

4. Becker E. W., Ehrfeld W., Hagmann P., Maner A., Munchmeyer D., Microelectron. Eng.4, 35 (1986).

5. W. Menz Sensors Actuators A54 785 (1996).

Cited by 155 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Auxetic mechanical metamaterials: from soft to stiff;International Journal of Extreme Manufacturing;2023-07-27

2. Understanding and Control of Compressively Buckled Semiconductor Thin Films;Physical Review Applied;2021-12-03

3. Application of negative Poisson’s ratio honeycomb structure in force measurement;Sensor Review;2021-10-11

4. Reducing Microfluidic Very Large-Scale Integration (mVLSI) Chip Area by Seam Carving;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2021-10

5. Biopatterning: The Art of Patterning Biomolecules on Surfaces;Langmuir;2021-08-04