Low thermal conductivity in a modular inorganic material with bonding anisotropy and mismatch

Author:

Gibson Quinn D.1ORCID,Zhao Tianqi2ORCID,Daniels Luke M.1ORCID,Walker Helen C.3ORCID,Daou Ramzy4,Hébert Sylvie4,Zanella Marco1ORCID,Dyer Matthew S.1ORCID,Claridge John B.1ORCID,Slater Ben2ORCID,Gaultois Michael W.15ORCID,Corà Furio2ORCID,Alaria Jonathan6ORCID,Rosseinsky Matthew J.1ORCID

Affiliation:

1. Department of Chemistry, University of Liverpool, Crown Street, Liverpool L69 7ZD, UK.

2. Department of Chemistry, University College London, 20 Gordon Street, Kings Cross, London WC1H 0AJ, UK.

3. ISIS Rutherford Appleton Laboratory, Chilton, Didcot OX11 0QX, UK.

4. Laboratoire CRISMAT, UMR 6508 CNRS, ENSICAEN, UNICAEN, Normandie Université, 6 bd du Maréchal Juin, 14050 Caen, France.

5. Leverhulme Research Centre for Functional Materials Design, The Materials Innovation Factory, University of Liverpool 51 Oxford Street, Liverpool L7 3NY, UK.

6. Department of Physics, University of Liverpool, Oliver Lodge Laboratory, Liverpool L69 ZE, UK.

Abstract

Blocking heat in two ways Low thermal conductivity is important for barrier coatings, thermoelectrics, and other applications. Gibson et al . combined two complementary methods that manipulate internal interface properties to dramatically decrease the thermal conductivity of the inorganic material BiO 2 Cl 2 Se (see the Perspective by Kim and Cahill). The authors took advantage of both in-plane structural distortions and weak bonding layers to push the conductivity down to 0.1 watts per kelvin per meter: only four times that of air. The principles should be applicable to other systems and provide a method for developing crystals with extremely low thermal conductivity. —BG

Funder

Engineering and Physical Sciences Research Council

Royal Society

Centre National de la Recherche Scientifique

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

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