TECHNOLOGY OF VACUUM TIGHT SEALING OF MICROBOLOMETER PACKAGE-Reference-Cited by-同舟云学术

TECHNOLOGY OF VACUUM TIGHT SEALING OF MICROBOLOMETER PACKAGE

Published:2024-04-24 Issue:1 Volume: Page:47-52
ISSN:2710-4230
Container-title:HERALD OF POLOTSK STATE UNIVERSITY. Series С FUNDAMENTAL SCIENCES
language:
Short-container-title:HERALD OF POLOTSK STATE UNIVERSITY. Series С FUNDAMENTAL SCIENCES

Author:

VIDRITSKY A.¹,LANIN V.²

Affiliation:

1. “INTEGRAL” Joint Stock Company

2. Belarusian State University of Informatics and Radioelectronics

Abstract

The features of the design of micro bolometer packages are considered, the choice of preform material for sealing the package with a soldered seam is made. The characteristics of getter films and the advantages of applying them to the reverse side of a germanium window are presented. A technique for vacuum-tight sealing of micro bolometer packages with germanium windows has been developed.

Publisher

Polotsk State University

Reference5 articles.

1. Ovsyuk, V. Shashkin, V., Demyanenko, M., Fomin, B., Vasil'ieva, L., & Soloviev, A. (2005). Uncooled microbolometer IR FPA based on sol-gel VOx. Proceedings of SPIE – The International Society for Optical Engineering, (5834), 47–54. DOI: 10.1117/12.628663.

2. Chistohin I. B., Dem'janenko M. A. (2006). Opredelenie teplovyh parametrov mikrobolometrov iz jelektricheskih izmerenij [Determination of Thermal Parameters of Microbolometers from Electrical Measurements]. Prikladnaja fizika [Applied Physics], (1), 91–95. (In Russ., abstr. in Engl.).

3. Timoshenkov, S. P., Bojko, A. N., Simonov, B. M., & Zavodjan, A. V. (2010). Tehnologii vakuumnoj germetizacii MjeMS. Izvestija vysshih uchebnyh zavedenij. Jelektronika [Proceedings of Universities. Electronics], 1(81), 11–23. (In Russ.).

4. Skupov, A. (2016). Vakuumnoe korpusirovanie na urovne plastiny – gettery [Vacuum Wafer Level Packaging: The Getters]. Jelektronika: Nauka, tehnologija, biznes, (5), 54–59. (In Russ.).

5. Dzhurinskij, K., & Liberov, B. (2016). Defekty pajki koaksial'nyh radiochastotnyh komponentov v korpusa izdelij i sposoby ih ustranenija. Tehnologii v jelektronnoj promyshlennosti, (1), 43–46. (In Russ.).