Abstract
As high heat flux density electronic devices become more miniaturized, lightweight, and highly integrated, the thermal management of these devices faces significant challenges. This paper proposes a bionic vapor chamber (B-VC) with a secondary groove structure to further enhance its heat transfer. Numerical simulation results demonstrate that the B-VC with the secondary groove structure can achieve better heat transfer performance than one without the secondary groove, as the secondary groove provides a larger heat transfer area. The heat transfer performance enhancement increases with an increase in the width of the secondary groove. However, the B-VC with the secondary groove incurs a higher pressure drop penalty. The effects of groove parameters, including the groove branch level and groove trunk width, on the overall performance were also investigated within the B-VC framework. The heat transfer performance enhancement increases with an increase in the groove branch level and groove trunk width. Based on a figure of merit (FOM) calculation, it is recommended that the groove branch level should be no more than two. Furthermore, the optimum groove trunk width was found to be 2 mm, which corresponds to a ratio of the gas-liquid channel cross-sectional areas of 14.3%.