Fine pitch Cu/Sn solid state diffusion bonding for advanced three-dimensional chip stacking
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/54/i=3/a=030203/pdf
Reference30 articles.
1. Through-silicon via and die stacking technologies for microsystems-integration
2. Assembly and reliability characterization of 3D chip stacking with 30μm pitch lead-free solder micro bump interconnection
3. The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering
4. Comparison of the electromigration behaviors between micro-bumps and C4 solder bumps
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