Relationship between aspect ratio and narrowing of reflowed photoresist structures
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/54/i=6S1/a=06FM01/pdf
Reference43 articles.
1. Hot embossing as a method for the fabrication of polymer high aspect ratio structures
2. High aspect ratio silicon etch: A review
3. SU-8: a photoresist for high-aspect-ratio and 3D submicron lithography
4. High-aspect-ratio, ultrathick, negative-tone near-UV photoresist and its applications for MEMS
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1. A 3D polydimethylsiloxane microhourglass-shaped channel array made by reflowing photoresist structures for engineering a blood capillary network;Methods;2020-04
2. Chemical and Molecular Variations in Commercial Epoxide Photoresists for X-ray Lithography;Applied Sciences;2018-03-30
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