Reliability of sintered silver layer obtained using silver-oxide paste in power cycling test
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/54/i=1/a=010302/pdf
Reference15 articles.
1. High-temperature electronics - a role for wide bandgap semiconductors?
2. SiC power-switching devices-the second electronics revolution?
3. Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly
4. Bonding Technique Using Micro-Scaled Silver-Oxide Particles for In-Situ Formation of Silver Nanoparticles
5. On-Chip Cellomics: Constructive Understanding of Multicellular Network Using On-Chip Cellomics Technology
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