Application of Al–Nb alloy film to metal capping layer on Cu
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Link
http://stacks.iop.org/1347-4065/55/i=2S/a=02BC22/pdf
Reference29 articles.
1. Electromigration Lifetime Improvement of Copper Interconnect by Cap/Dielectric Interface Treatment and Geometrical Design
2. Void formation in the Cu layer during thermal treatment of SiNx/Cu/Ta73Si27/SiO2/Si systems
3. Relationship between interfacial adhesion and electromigration in Cu metallization
4. Reduced electromigration of Cu wires by surface coating
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1. Protection of Cu from Oxidation by Ta Capping Layer;Coatings;2023-05-15
2. Al(111) orientation and thermal stability of the system using Al3Nb thin film;Japanese Journal of Applied Physics;2022-05-01
3. Upward Unsteady-State Solidification of Dilute Al–Nb Alloys: Microstructure Characterization, Microhardness, Dynamic Modulus of Elasticity, Damping, and XRD Analyses;Metals;2019-06-25
4. Characterization of Electroless-Deposited Ternary M1M2-R (M1 = Co, Ni, M2 = W, Mo, R = P, B) Nano Thin Film for Optical-Sensor Interconnects;Science of Advanced Materials;2017-11-01
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