SURFACE ROUGHNESS OF SPUTTERED SILICON. I. SURFACE MODELING

Author:

Ali M. Y.,Hung N. P.

Publisher

Informa UK Limited

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference22 articles.

1. Mathematical modeling of focused ion beam microfabrication

2. Depth control of focused ion-beam milling from a numerical model of the sputter process

3. The nanoworld: chances and challenges

4. Ali, M. Y., Hung, N. P. and Yuan, S. 2000. Simulation of Micro-Injection Molding. Proceedings of the International Conference on Precision Engineering. 2000, Singapore. pp.535–540.

5. Ehrfeld, W., Lehr, H., Michel, F. and Wolf, A. 1996. Microelectro Discharge Machining as a Technology in Micromachining. Proceedings of the International Conference on Micromachining and Microfabrication Process Technology II, SPIE 2879. 1996. pp.332–337.

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5. An accurate and efficient control over the present numerical model of depth of sputtering in focused ion beam milling;Proceedings of the Institution of Mechanical Engineers, Part N: Journal of Nanoengineering and Nanosystems;2009-03-01

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