Al–SiC ELECTRONIC PACKAGES WITH CONTROLLED THERMAL EXPANSION COEFFICIENT BY A NEW METHOD OF PRESSURELESS INFILTRATION-Reference-Cited by-同舟云学术

Al–SiC ELECTRONIC PACKAGES WITH CONTROLLED THERMAL EXPANSION COEFFICIENT BY A NEW METHOD OF PRESSURELESS INFILTRATION

Published:2001-06-30 Issue:6 Volume:16 Page:779-788
ISSN:1042-6914
Container-title:Materials and Manufacturing Processes
language:en
Short-container-title:Materials and Manufacturing Processes

Author:

Hemambar Ch.,Rao B. Srinivasa,Jayaram V.

Publisher

Informa UK Limited

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://www.tandfonline.com/doi/pdf/10.1081/AMP-100108698

Reference17 articles.

1. Occhionero, M. A., Adams, R. W. and Fennessy, K. P. 2001. Enhanced Thermal Management Al-SiC Microprocessor Lids. IMAPS ATW Thermal Management for High-Performance Computing and Wireless Applications. April20–212001, Palo Alto, CA. www.alsic.comaccessed July 2001

2. Occhionero, M. A., Adams, R. W., Fennessy, K. P. and Hay, R. A. 1999. Aluminum Silicon Carbide AlSic Thermal Management Packaging for High Density Packaging Applications. Proceedings of International Conference on High Density Packaging and MCM's. April6–91999, Denver, CO. www.alsic.comaccessed July 2001

3. Occhionero, M. A., Adams, R. W., Fennessy, K. P. and Hay, R. A. 1998. Aluminum Silicon Carbide AlSic for Advanced Microelectronic Packages. Proceedings of the 25th Annual IMAPS NE Symposium. May141998, Andover, MA. www.alsic.comaccessed July 2001

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