Image sensor for spectral‐domain optical coherence tomography on a chip
Author:
Affiliation:
1. ams AGPremstaettenAustria
2. Institute of ElectrodynamicsMicrowave and Circuit EngineeringVienna University of TechnologyViennaAustria
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/el.2020.1898
Reference11 articles.
1. ThackerH.D.LuoY.ShiJ.et al.: ‘Flip‐chip integrated silicon photonic bridge chips for sub‐picojoule per bit optical links’.2010 Proc. 60th Electronic Components and Technology Conf. (ECTC) Las Vegas NV USA 2010 pp.240–246 doi:10.1109/ECTC.2010.5490965
2. SillonN.AstierA.BoutryH.et al.: ‘Enabling technologies for 3D integration: From packaging miniaturization to advanced stacked ICs’.2008 IEEE Intl. Electron Devices Meeting San Francisco CA USA 2008 pp.1–4 doi:10.1109/IEDM.2008.4796761
3. FossumE.R.: ‘Active Pixel Sensors: Are CCDs dinosaurs?’.Proc. SPIE CCD's Optical Sensors III San Jose CA USA 1993 vol.1900 pp.2–14 doi:10.1117/12.148585
4. Integrated Silicon Optoelectronics
5. Investigation of the impact of water absorption on retinal OCT imaging in the 1060 nm range
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Large Active Area, Low Capacitance Multi-Dot PIN Photodiode in 0.35 m CMOS Technology;IEEE Photonics Journal;2024-02
2. Ultra-Low Capacitance Spot PIN Photodiodes;IEEE Photonics Journal;2023-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3