Improved thermal management of power cells with adding cooling path from collector to ground-Reference-Cited by-同舟云学术

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Improved thermal management of power cells with adding cooling path from collector to ground

Published:2019-05 Issue:9 Volume:55 Page:513-515
ISSN:0013-5194
Container-title:Electronics Letters
language:en
Short-container-title:Electron. lett.

Author:

Tian Ting¹,Sun Xiaohong²,Gao Huai³,Lu Shengli¹

Affiliation:

1. National ASIC System Engineering Centre, Southeast UniversityNanjing210096People's Republic of China

2. Suzhou University of Science and TechnologySuzhou215000People's Republic of China

3. Suzhou Innotion Technology Co., Ltd.Suzhou215123People's Republic of China

Funder

National Natural Science Foundation of China

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/el.2019.0364

Reference5 articles.

1. Improved thermal management of InP transistors in transferred‐substrate technology with diamond heat‐spreading layer

2. Peripheral adaption power cell network for high efficiency and high linearity power amplifier;Sun X.;Microw. Wirel. Compon. Lett.,2014

3. Thermal design and characterization of heterogeneously integrated InGaP/GaAs HBTs;Choi S.;Trans. Compon. Packag. Manuf. Technol.,2016

4. Thermal performance of collector‐up HBTs for small high‐power amplifiers with a novel thermal via structure underneath the HBT fingers;Osone Y.;Trans. Compon. Packag. Technol.,2005

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1. Junction Temperature Prediction Model for GaAs HBT Devices Based on ASO-ELM;Processes;2023-04-27

2. Enhanced Thermal Management of GaN Power Amplifier Electronics with Micro-Pin Fin Heat Sinks;Electronics;2020-10-27

3. Thermal characterization and design of GaAs HBT with heat source drifting effects under large current operating condition;Microelectronics Journal;2020-06

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