Method of mould alignment for double‐sided hot embossing of microfluidic devices using kinematic constraints-Reference-Cited by-同舟云学术

Method of mould alignment for double‐sided hot embossing of microfluidic devices using kinematic constraints

Published:2014-10 Issue:10 Volume:9 Page:741-745
ISSN:1750-0443
Container-title:Micro & Nano Letters
language:en
Short-container-title:Micro & Nano Letters

Author:

Conner Timothy¹,Song In‐Hyouk¹²,Park Taehyun³,You Byoung Hee¹²

Affiliation:

1. Department of Engineering TechnologyTexas State UniversitySan MarcosTX78666USA

2. Material Science, Engineering, and Commercialization ProgramTexas State UniversitySan MarcosTX78666USA

3. School of Mechanical EngineeringKyungnam UniversityChangwon631‐701Republic of Korea

Publisher

Institution of Engineering and Technology (IET)

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,Bioengineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/mnl.2014.0134

Reference14 articles.

1. Study of Double-Side Ultrasonic Embossing for Fabrication of Microstructures on Thermoplastic Polymer Substrates

2. An approach to multilayer microfluidic systems with integrated electrical, optical, and mechanical functionality

3. KarlssonJ.M.HaraldssonT.CarlborgC.F.WijngaartW.: ‘A double‐sided micromolding process for reproducible manufacturing of thin layers and 3D microchannels in PDMS’.Proc. Micro TAS Okinawa Japan 2012 pp.659–661

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