Fast Si (100) etching with a smooth surface near the boiling temperature in surfactant‐modified tetramethylammonium hydroxide solutions
Author:
Affiliation:
1. Institute of Electronic EngineeringChina Academy of Engineering PhysicsMianyang621999People's Republic of China
2. Department of Mechanical EngineeringAichi Institute of TechnologyToyota4700392Japan
Publisher
Institution of Engineering and Technology (IET)
Subject
Condensed Matter Physics,General Materials Science,Biomedical Engineering,Bioengineering
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/mnl.2014.0214
Reference18 articles.
1. Scalloping removal on DRIE via using low concentrated alkaline solutions at low temperature
2. Micromachined hetero-core anti-scatter grid for a digital X-ray image sensor
3. Silicon anisotropic etching in TMAH solutions containing alcohol and surfactant additives
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