Experimental investigation of multi‐path and metal‐stacking structure for 8‐shape on‐chip inductors on standard CMOS
Author:
Affiliation:
1. School of Physics and ElectronicsHunan UniversityChangsha410082People's Republic of China
Funder
National Natural Science Foundation of China
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/el.2016.3442
Reference8 articles.
1. Design of novel high‐Q multipath parallel‐stacked inductor;Vanukuru V.N.R.;Trans. Electron Devices,2014
2. Design of Novel High-$Q$-Factor Multipath Stacked On-Chip Spiral Inductors
3. Design of multiple‐metal stacked inductors incorporating an extended physical model;Murphy O.H.;Trans. Microw. Theory Tech.,2005
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Compact and low phase noise LC‐VCO design using novel V‐shaped inductor in 0.18‐μm CMOS technology for Ku‐band applications;International Journal of Circuit Theory and Applications;2023-08-02
2. Analysis and Implementation of a Multi-path and Metal-Stacked 8-Shaped Inductor;Lecture Notes in Electrical Engineering;2023
3. K-band low phase noise Class-C VCOs using DGS inductor in CMOS technology;Microelectronics Journal;2022-04
4. Design of a Novel High Q Multi-layer Inductor for VCO Applications;Silicon;2022-02-19
5. High-quality factor multipath differential fractal inductor for wireless applications;Circuit World;2021-05-31
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3