Integration of inverted InGaAs MSM array on Si substrate through low temperature wafer bonding
Author:
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://digital-library.theiet.org/content/journals/10.1049/el.2011.3502?crawler=true&mimetype=application/pdf
Reference5 articles.
1. Hybrid Silicon Photonics for Optical Interconnects
2. Embedded optical interconnections using thin film InGaAs metal-semiconductor-metal photodetectors
3. High-Speed Large-Area Inverted InGaAs Thin-Film Metal–Semiconductor–Metal Photodetectors
4. Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking
5. Massalski, T.B., and Okamoto, H.: ‘Binary alloy phase diagrams’, (ASM International, Metal Park, OH, USA 1990)
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