Resistive Switching Characteristics of a Tin/Ti Electrode with a Graphene Interlayer in Zno/Hfo2 Rram

Author:

Kwon So-Yeon,Ko Woon-San,Kim Ki-Nam,Byun Jun-Ho,Lee Do-Yeon,Lee Hi-Deok,Lee Ga-Won

Publisher

Elsevier BV

Reference38 articles.

1. Metal–Oxide RRAM

2. Leakage current-forming voltage relation and oxygen gettering in HfO x RRAM devices;K G Young-Fisher;IEEE electron device letters,2013

3. Effects of Ti top electrode thickness on the resistive switching behaviors of rf-sputtered ZrO2 memory films;S.-Y Wang;Applied Physics Letters,2009

4. The role of Ti capping layer in HfO x-based RRAM devices;Z Fang;IEEE Electron Device Letters,2014

5. Self-compliance and high performance Pt/HfOx/Ti RRAM achieved through annealing;L Wu;Nanomaterials,2020

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