Effect of Co and P Addition on the Thermal Stress Relaxation Resistance of Cu-15Ni-8Sn Alloy-Reference-Cited by-同舟云学术

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Effect of Co and P Addition on the Thermal Stress Relaxation Resistance of Cu-15Ni-8Sn Alloy

Published:2021 Issue: Volume: Page:
ISSN:1556-5068
Container-title:SSRN Electronic Journal
language:en
Short-container-title:SSRN Journal

Author:

Gong Yahui,Huang Jian,Shi Yufan,Guo Chengjun,Xiao Xiangpeng,An Guihuan,Yang Bin

Publisher

Elsevier BV

Subject

General Earth and Planetary Sciences,General Environmental Science

Reference37 articles.

1. Elevated temperature tensile behaviour of a Cu-4.5Ti alloy;S Nagarjuna;Mater. Sci. Eng. A,2005

2. Precipitation behavior, microstructure and properties of aged Cu-1.7 wt% Be alloy;H T Zhang;J Alloy Compd,2019

3. Compositional partitioning during the spinodal decomposition in Cu-Ni-Sn alloy;C B Basak;Philos Mag,2018

4. Dry sliding of Cu-15 wt%Ni-8 wt%Sn bronze: Wear behaviour and microstructures;J B Singh;Wear,2007

5. A low Sn content Cu-Ni-Sn alloy with high strength and good ductility;B M Luo;Mater. Sci. Eng. A,2019

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