Author:
Gong Tianjiao,Suzuki Yukio,Hiller Karla,Tanaka Shuji
Reference21 articles.
1. Silicon-to-silicon direct bonding method;M Shimbo;Journal of Applied Physics,1986
2. Silicon-on-insulator (SOI) by bonding and etchback;J B Lasky;1985 International Electron Devices Meeting,1985
3. Semiconductor wafer bonding;U G�sele;Annual review of materials science,1998
4. Silicon migration seal wafer-level vacuum encapsulation;Y Suzuki;Elect. Comm. Jpn,2021
5. Silicon direct bonding;Thomas Plach;Handbook of Silicon Based MEMS Materials and Technologies,2020