Detection of BGA solder defects from X-ray images using deep neural network-Reference-Cited by-同舟云学术

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Detection of BGA solder defects from X-ray images using deep neural network

Published:2020-07-29 Issue:4 Volume:28 Page:2020-2029
ISSN:1303-6203
Container-title:TURKISH JOURNAL OF ELECTRICAL ENGINEERING & COMPUTER SCIENCES
language:
Short-container-title:Turk J Elec Eng & Comp Sci

Author:

TÜRER AKDENİZ Ceren^ORCID,DOKUR Zümray^ORCID,ÖLMEZ Tamer^ORCID

Publisher

The Scientific and Technological Research Council of Turkey (TUBITAK-ULAKBIM)

Subject

Electrical and Electronic Engineering,General Computer Science

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Research for Quickly Measuring the Diameter and Roundness of Solder Balls Based on Machine Vision Technology;Journal of Electronic Packaging;2023-12-11

2. Deep Learning Based Printed Circuit Boards Defect Detection Using Multiple Depth 2D X-Ray Image;2023 15th International Conference on Information Technology and Electrical Engineering (ICITEE);2023-10-26

3. Adaptive Hybrid Framework for Multiscale Void Inspection of Chip Resistor Solder Joints;IEEE Transactions on Instrumentation and Measurement;2023

4. Automatic detection method for BGA defects based on x-ray imaging;Applied Optics;2022-07-19

5. Adaptive Inspection for Void Defects Inside Solder Joints of Chip Resistors;J ELECTRON INF TECHN;2022

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