Temperature and pressure effects on microchannels dimensions in hot embossing

Author:

Koochaksaraei Mohammad Mashhadban,Ahmadi IsaORCID,Hajian RaminORCID,Mohammadi Mohammad Mostafa

Abstract

Abstract Hot embossing is a microfabrication technique for making microchannels and microfluidic devices. Temperature and pressure along with the material thermos-mechanical properties are the key parameters in controlling the shape of embossed channels. In this paper, experimental and numerical investigations of pressure and temperature effects on channel dimensions are presented. The material used as workpieces is poly methyl methacrylate (PMMA). The depth, upper width and lower width are the main dimensions of microchannel which are studied in this work. Experiments were performed at temperatures of 140 °C, 150 °C, 160 °C, 170 °C and 180 °C and pressures of 235, 295 and 340 kPa. Numerical and experimental results show a good agreement, i.e. 6.7% difference in dimensional length in the worst case and less than 0.3% in the best case. Based on width and depth values obtained via both experiments and simulations an optimum condition of temperature and pressure is presented in this paper for forming of microchannel on PMMA. Based on performed experiments, 150 °C with 295 kPa is found to be the nearest condition to the optimum point.

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Lab-on-a-chip: Unit Operations to Scale-up Strategies;Lab-on-a-chip Devices for Advanced Biomedicines;2024-08-14

2. Investigation and multi-objective optimization of replication accuracy of microfluidic chip fabricated through induction-aided hot embossing;Journal of the Brazilian Society of Mechanical Sciences and Engineering;2023-11-12

3. Experimental investigation of replication accuracy of polymer-based microfluidic chip fabricated through induction-assisted hot embossing and parametric optimization through nature-inspired algorithms;Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering;2023-08-09

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