Applicability of normalized resistance rate model for predicting fatigue life and resistance evolution in composite conductive inks

Author:

Li Qiushi,Pierron OlivierORCID,Antoniou AntoniaORCID

Abstract

Abstract The electrical resistance of metal-polymer conductive inks increases as they undergo cyclic loading, posing a major challenge to their reliability as interconnect materials for flexible electronic devices. To characterize an ink’s fatigue performance, extensive electro-mechanical testing is usually performed. Phenomenological models that can accurately predict the resistance increase with cyclic loading can save time and be useful in flexible conductor design against fatigue failure. One such model was recently developed for only one composite ink type. The model is based on experiments monitoring resistance under monotonic stretch data and multiple experiments measuring the rate of increase of the resistance under different strain amplitudes and mean strains. The current work examines whether such resistance rate model could be generalized to apply for more types of composite inks. Two composite inks with different binder material, metal flake sizes and shapes, and substrate material were experimentally tested under monotonic and cyclic loading. It was found that the two new inks are also more sensitive to strain amplitude than mean strain. The resistance rate model accurately predicts early/catastrophic failure (<1000 cycles) in all inks and conservatively estimates high fatigue life for low strain amplitudes. A protocol detailing the procedures for applying the resistance model to new inks is outlined.

Funder

NextFlex

National Science Foundation

Publisher

IOP Publishing

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