Resistance of copper nanowires and comparison with carbon nanotube bundles for interconnect applications using first principles calculations
Author:
Publisher
IOP Publishing
Subject
Condensed Matter Physics,General Materials Science
Link
http://stacks.iop.org/0953-8984/20/i=9/a=095209/pdf
Reference30 articles.
1. Performance analysis of carbon nanotube interconnects for VLSI applications
2. Carbon nanotubes in interconnect applications
3. Bottom-up approach for carbon nanotube interconnects
4. Reliability and current carrying capacity of carbon nanotubes
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