In situstress evolution during and after sputter deposition of Al thin films
Author:
Publisher
IOP Publishing
Subject
Condensed Matter Physics,General Materials Science
Link
http://stacks.iop.org/0953-8984/21/i=22/a=225008/pdf
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1. The Power Durability of 900 MHz Band Double-Mode-Type Surface Acoustic Wave Filters and Improvement in Power Durability of Al–Cu Thin Film Electrodes by Cu Atom Segregation
2. Strain Analysis in Fine Al Interconnections by X-Ray Diffraction Spectrometry Using Micro X-Ray Beam
3. Power Durability of Al–W Alloy Electrodes Used in RF-Band Surface Acoustic Wave Filters
4. Multilevel interconnections for ULSI and GSI era
5. Formation of aluminum oxynitride diffusion barriers for Ag metallization
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