Micromechanics in optical microsystems - with focus on telecom systems
Author:
Publisher
IOP Publishing
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. Passive coupling of InGaAsP/InP laser array and singlemode fibres using silicon waferboard
2. LIGA-based flexible microstructures for fiber-chip coupling
3. A high-density, four-channel, OEIC transceiver module utilizing planar-processed optical waveguides and flip-chip, solder-bump technology
4. Micromachining processes and structures in micro-optics and optoelectronics
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Method of mould alignment for double‐sided hot embossing of microfluidic devices using kinematic constraints;Micro & Nano Letters;2014-10
2. Passive micro-assembly of modular, hot embossed, polymer microfluidic devices using exact constraint design;Journal of Micromechanics and Microengineering;2009-11-16
3. Passive Alignment Structures in Modular, Polymer Microfluidic Devices;Microelectromechanical Systems;2006-01-01
4. Precision passive mechanical alignment of wafers;Journal of Microelectromechanical Systems;2003-12
5. Debris-reduced laser machining of polymeric waveguides for optoelectronic applications;SPIE Proceedings;2001-06-29
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