A novel capacitive accelerometer with an eight-beam-mass structure by self-stop anisotropic etching of (1 0 0) silicon-Reference-Cited by-同舟云学术

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A novel capacitive accelerometer with an eight-beam-mass structure by self-stop anisotropic etching of (1 0 0) silicon

Published:2008-05-21 Issue:7 Volume:18 Page:075005
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Xiao Fei,Che Lufeng,Xiong Bin,Wang Yuelin,Zhou Xiaofeng,Li Yufang,Lin Youling

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. Micromachined inertial sensors

2. Wide dynamic range direct accelerometer

3. A highly symmetrical capacitive micro-accelerometer with single degree-of-freedom response

4. An all-silicon single-wafer micro-g accelerometer with a combined surface and bulk micromachining process

5. Accelerometer systems with self-testable features

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Full 3D Printing Method for Monolithic Integration of an Accelerometer and a Force Sensor;2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS);2023-01-15

2. A rapid fabrication approach for the capacitive accelerometer based on 3D printing and a silver particle-free ink;Journal of Materials Science: Materials in Electronics;2021-06-11

3. A novel single axis capacitive MEMS accelerometer with double-sided suspension beams fabricated using μWEDM;Sensors and Actuators A: Physical;2020-07

4. Modified Au/bulk Si eutectic bonding structure with reliable compatibility of KOH etching based on two-step local oxidation of silicon;Semiconductor Science and Technology;2020-04-03

5. A novel capacitive micro-accelerometer made of steel using micro wire electrical discharge machining method;Journal of Micromechanics and Microengineering;2019-11-05

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