Study of microsecond X-pinches of refractory and non-refractory metals

Author:

Andola Sanjay ChandraORCID,Jaiswar Ashutosh Chandrajeet,Kaushik Trilok Chand,Joshi Keshaw Datt

Abstract

Abstract In this report, we present a comparative study on the properties of x-rays from X-pinches made of two groups of metallic wires. The results were obtained on a small current driver having dI/dt of 0.04–0.11 kA ns−1. The X-pinches made of refractory (Mo and W) and non-refractory (Al and Cu) wires were studied for the current required to pinch and their x-ray parameters such as x-ray yield, timing, jitter, number of bursts, and source size. It has been observed that despite lower linear mass density, the Cu group requires a higher current for plasma to pinch than the W group X-pinches. For a given configuration, a faster current compresses the plasma at a higher current which leads to comparatively higher x-ray yield. Substantial enhancement in the quality of x-rays has also been observed in wires with few micron thick dielectric coating. The results of this work can be useful in the development of a small capacitive X-pinch system suitable for studies related to high energy density physics.

Publisher

IOP Publishing

Subject

Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference36 articles.

1. X-pinch soft x-ray source for microlithography;Hammer;Appl. Phys. Lett.,1990

2. Characterization of X-pinch plasma;Qi;Rev. Sci. Instrum.,1990

3. Hybrid X-pinch with conical electrodes;Shelkovenko;Phys. Plasmas,2010

4. X-pinch. Part I;Pikuz;Plasma Phys. Rep.,2015

5. X-pinch. Part II;Pikuz;Plasma Phys. Rep.,2015

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3