Assessment of Stress and Strain Distribution at Crack Tip Using Digital Image Correlation

Abstract

Abstract DIC program developed to obtain the full-field measurements of displacement, strain, and stress around the crack/defect. In the present work, the tensile test is conducted for two different flat specimens, which were painted by speckle pattern to allow using features of DIC system for strain measurements. Two defected/cracked copper and aluminum samples have been investigated. The experimental rig was especially designed and manufactured to perform the tensile test. A comparison between the results of the technique investigated with the results obtained from open source software (Ncorr & GOM), results obtained from the finite element analysis using (ANSYS) software using, and the exact and analytical solutions. The results achieved by the proposed DIC technique have agreement with other methods. The experiments conducted for two flat Aluminum and Copper plates. The DIP percentage of accuracy varies from (97) % to (99) % with the actual physical measurements. The obtained DIC percentage of accuracy as minimum and maximum were (88) % and (95) % with ANSYS software.