Simulation and experimental investigation of contact spot temperature for electrical contact components

Author:

Zhang Chao,Zhao Zien,Ren Wanbin

Abstract

Abstract The contact spot temperature of electrical contact components substantially affects the reliability and electrical life of any electrical connections within the electrical engineering. In this paper, finite element model of typical spring structure components is built by using COMSOL Multiphysics software. Furthermore, the transient process of contact temperature is simulated by taking account of film resistance on the contact surface. Moreover, a test rig is introduced that makes it possible to measure the electrical contact resistance and temperature within the electrical contact components simultaneously. Finally, correlation between contact resistance and contact spot temperature with different contact force and current levels are investigated explicitly.

Publisher

IOP Publishing

Subject

General Medicine

Reference8 articles.

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3. On the spreading resistance of thin-film contacts;Zhang;IEEE Transactions on electron devices,2012

4. Constriction resistance of thin-film contacts;Timsit;IEEE Transactions Compon. Packag. Technol,2010

5. Applicability and correction of temperature-voltage relation in the case of point contact;Sano;IEEE Transactions on components, packaging, and manufacturing technology-Part A,1998

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