Research on PCB layout optimization of vehicle controller based on electrothermal hybrid simulation

Abstract

Abstract With the rapid development of the electronic industry, electronic equipment is more and more widely used in automobiles. The integration of electronic components on the Printed Circuit board (PCB) is getting higher and higher, the size is getting smaller and smaller, and the power is getting larger and larger, which leads to a sharp increase in the heat flow density of the whole PCB. The surface temperature of the chip is too high when it is working, which leads to a series of thermal failure problems. In order to improve the thermal characteristics between PCB and electronic components and improve the heat dissipation capability and reliability of PCB, this paper designed a vehicle controller PCB. PowerDC was used to conduct an electrothermal hybrid simulation analysis, and the temperature distribution of the whole board was obtained. Meanwhile, the structural layout of the PCB was optimized by increasing the heat dissipation hole, floor copper foil, and wiring width. Thus, the temperature of PCB and electronic components is reduced, which provides a vital reference for the thermal design of PCB.