Investigating the influence of chromium layer thickness on thermal stability, adhesion and agglomeration of Cr/Ag/Cr sandwich layers in microelectromechanical systems (MEMS)

Abstract

Abstract This study explores the influence of chromium layer thickness on the thermal stability and agglomeration of Cr/Ag/Cr sandwich layers used in MEMS applications. Achieving uniform and consistent deposition of thin films is crucial for optimal device performance. Magnetron sputtering, a technique offering precise control over film properties, is commonly employed for depositing thin films in MEMS. Silver is a popular choice due to its desirable properties, but it tends to agglomerate at high temperatures. The researchers investigated the effect of chromium layer thickness on thermal stability and agglomeration. They deposited chromium layers of varying thicknesses onto silicon substrates, followed by a silver layer and another chromium layer to create a sandwich structure. Annealing was performed at different temperatures to assess thermal stability and prevent silver agglomeration. Thermal stability was evaluated by measuring electrical resistance using a four-point probe method, and surface topography was analyzed using a non-contact atomic force microscope. The goal was to identify the optimal chromium layer thickness to minimize agglomeration and maximize thermal stability. The results showed that a sandwich structure with a 5 nm top chromium layer (Si/Cr (5 nm)/Ag (100 nm)/Cr (5-10-15-20 nm)) exhibited decreased adhesion force with increasing annealing temperatures. The use of a chromium sandwich layer significantly reduced surface roughness, as indicated by reductions in Ra and RMS values. A 15 nm thick chromium layer above and below the silver layer provided the best thermal stability and prevented silver agglomeration, resulting in the highest degree of adhesion. This thickness also yielded optimal surface parameters for the chromium sandwich layers at the annealing temperatures. In conclusion, the study demonstrates that the thickness of the chromium layer influences thermal stability, agglomeration, and surface parameters in MEMS applications and enables better control over thin film deposition.