The reduction of copper oxide thin films with hydrogen plasma generated by an atmospheric-pressure glow discharge-Reference-Cited by-同舟云学术

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The reduction of copper oxide thin films with hydrogen plasma generated by an atmospheric-pressure glow discharge

Published:1996-10-14 Issue:10 Volume:29 Page:2539-2544
ISSN:0022-3727
Container-title:Journal of Physics D: Applied Physics
language:
Short-container-title:J. Phys. D: Appl. Phys.

Author:

Sawada Yasushi,Tamaru Hiroshi,Kogoma Masuhiro,Kawase Motoaki,Hashimoto Kenji

Publisher

IOP Publishing

Subject

Surfaces, Coatings and Films,Acoustics and Ultrasonics,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://stacks.iop.org/0022-3727/29/i=10/a=003/pdf

Reference22 articles.

1. Selective electroless copper for VLSI interconnection

2. Surface characterization of the copper–epoxy adhesion interface from production printed circuit boards

3. Oxidation of Cu in contact with preimidized polyimide

4. Studies of the interface between the epoxy molding compound and the copper leadframe by x‐ray photoelectron spectroscopy, Auger electron spectroscopy, and secondary electron microscopy

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