Polyimide Containing an Acetal Structure with a Photoacid Generator: A Novel Positive Polyimide Photoresist

Author:

Akimoto Satoshi1,Kato Daisuke,Jikei Mitsutoshi,Kakimoto Masa-aki2

Affiliation:

1. Materials Research Laboratory, Technical Research Institute, Toppan Printing Co., Ltd, 4-2-3, Takanodaiminami, Sugito-machi, Kitakatsushika-gun, Saitama 345-8508, Japan

2. Department of Organic and Polymeric Materials, Tokyo Institute of Technology, 2-12-1, O-okayama, Meguro-ku, Tokyo 152-8552, Japan

Abstract

A main-chain degradable photosensitive polyimide containing an acetal structure which degrades by the action of acid coming from a photoacid generator has been developed. Polyimides 4 were prepared by the reaction of bis(4-aminophenoxy)methane 1 and various tetracarboxylic anhydrides 2, followed by thermal treatment. In the resulting polyimides 4, 4f filmderivedfrom 4,4′-hexafluoroisopropylidenebis(phthalicanhydride)(6FDA)and 1 showedgood solubility in organic solvents and transparency to UV light. The acid-catalysed degradation reaction was confirmed by the model imide compound in the presence of p-toluenesulfonic acid. The system of the polyimide 4f containing 30 wt% of diphenyliodonium 9,10-dimethoxyanthracene-2-sulfonate (DIAS), which is a photoacid generator (PAG) showed a sensitivity of 150 mJ cm−2 with 436 nm light, when it was post-exposure baked at 140°C for 30 min, followed by development with 5% tetramethylammonium hydroxide solution at 45°C.

Publisher

SAGE Publications

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

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