Abstract
Abstract
Ionic polymer metal composites (IPMCs) are a class of materials with a rising appeal in biological micro-electromechanical systems (bio-MEMS) due to their unique properties (low voltage output, bio-compatibility, affinity with ionic medium). While tailoring and improving actuation capabilities of IPMCs is a key motivator in almost all IPMC manufacturing reports, very little efforts have been dedicated to sensing using IPMC thinner than 100 µm. Most reports on IPMC manufacturing and utilization rely on 180 µm-thick Nafion with platinum electrodes, too stiff for bio-MEMS applications. The same fabrication process on thinner membranes does yield in very poor electrodes and performance, and needs to be studied to increase flexibility and sensitivity in the microscale range. This study demonstrates an electroless Pt deposition method for fabricating bio-MEMS-suitable 50 µm-thick IPMC samples. First, we perform a comparative study on the platinum distribution within the Nafion backbone as well as on the surface for the standard electroless deposition recipe for thin (50 µm) and thick (180 µm) Nafion. We report strong differences in platinum distribution for thick and thin IPMC that experienced the same manufacturing process. By varying chemical concentrations from the standard recipe we obtain convenient platinum distribution on thin Nafion, with platinum mainly localized in proximity of surface, as well as electrodes with lower sheet resistance. We could measure the flexural rigidity as
3.43
×
10
−
8
N·m2, 46 times lower than standard 180 µm-thick IPMC. The calculated sensitivity is 0.476 ± 0.02 mV mm−1 and the limit of detection for our sensor is 500 ± 20 µm. This procedure sets a milestone for manufacturing 50 µm-thick IPMC for transducers and sensors in bio-MEMS applications.
Funder
Netherlands Organ-on-Chip Initiative
Subject
Electrical and Electronic Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics,Civil and Structural Engineering,Signal Processing
Cited by
6 articles.
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