Analysis of electromagnetic-thermal coupling braking properties of combined electromagnetic friction and shape memory alloy brake

Author:

Gong HangORCID,Xiong YangORCID,Huang Jin

Abstract

Abstract To address the problems of severe heat generation and poor stability of traditional electromagnetic friction brakes, combined electromagnetic friction and shape memory alloy (SMA) braking method is proposed. This novel brake solves the traditional electric brake thermal decay problem based on the temperature sensing ability of SMA, which improves its working stability in a high-temperature environment. Based on Ampere’s law of magnetic field, the relationship between current and electromagnetic force was established, and the equation of electromagnetic force braking torque was derived. Based on the thermodynamic model of a SMA, the relationship between the frictional torque of SMA and parameters such as temperature, squeezing pressure, and structure size was established. The magnetic and thermal fields of this brake were analyzed by the finite element method to obtain the magnetic field distribution and the magnitude of electromagnetic force at different currents and to derive the temperature distribution of the brake at different currents. The brake was analyzed by the SMA squeezing pressure test platform and the braking performance test platform. The results show that the electromagnetic torque grows non-linearly with temperature, and the squeezing force generated by the SMA spring increases with temperature. When the current is 0.7 A, the braking torque generated by electromagnetism is 170.3 N m, while the maximum braking torque generated by the combination of electromagnetism and SMA is 212.6 N m, which is 20.4% higher than that of the traditional electromagnetic friction brake. This novel brake improves braking performance and ensures stable braking performance under temperature rise.

Funder

National Natural Science Foundation of China

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics,Civil and Structural Engineering,Signal Processing

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