Atomistic simulations of grain boundary migration under recrystallisation conditions-Reference-Cited by-同舟云学术

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Atomistic simulations of grain boundary migration under recrystallisation conditions

Published:2019-06-05 Issue:6 Volume:27 Page:064002
ISSN:0965-0393
Container-title:Modelling and Simulation in Materials Science and Engineering
language:
Short-container-title:Modelling Simul. Mater. Sci. Eng.

Author:

Race C P^ORCID

Funder

Royal Society

Publisher

IOP Publishing

Subject

Computer Science Applications,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modelling and Simulation

Link

https://iopscience.iop.org/article/10.1088/1361-651X/ab2176/pdf

Reference23 articles.

1. Investigating the mechanisms of grain boundary migration during recrystallization using molecular dynamics

2. A review of microstructural computer models used to simulate grain growth and recrystallisation in aluminium alloys

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Preface for MMM 2018 focus issue;Modelling and Simulation in Materials Science and Engineering;2020-02-18

2. Carbide effects on tensile deformation behavior of [001] symmetric tilt grain boundaries in bcc Fe;Modelling and Simulation in Materials Science and Engineering;2020-02-05

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