Deformation behavior of Cu nanowire with axial stacking fault
Author:
Publisher
IOP Publishing
Subject
Metals and Alloys,Polymers and Plastics,Surfaces, Coatings and Films,Biomaterials,Electronic, Optical and Magnetic Materials
Link
http://iopscience.iop.org/article/10.1088/2053-1591/ab17c1/pdf
Reference39 articles.
1. Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale
2. Interaction between a screw dislocation and stacking faults in FCC metals
3. Dependence of equilibrium stacking fault width on thickness of Cu thin films: A molecular dynamics study
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