Structure–Property relationships of Inconel 625 Cladding on AISI 316L substrate produced by Hot Wire (HW) TIG metal deposition technique
Author:
Publisher
IOP Publishing
Subject
Metals and Alloys,Polymers and Plastics,Surfaces, Coatings and Films,Biomaterials,Electronic, Optical and Magnetic Materials
Link
http://iopscience.iop.org/article/10.1088/2053-1591/ab350f/pdf
Reference42 articles.
1. Investigation on TIG cladding of copper alloy on steel plate
2. Study of the hot-wire TIG process with AISI-316L filler material, analysing the effect of magnetic arc blow on the dilution of the weld bead
3. Investigating laser rapid manufacturing for Inconel-625 components
Cited by 20 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Effects of the shielding gas and substrate thickness on dilution and microstructure of Inconel® 625 MIG/MAG welded coatings;Journal of the Brazilian Society of Mechanical Sciences and Engineering;2024-06-18
2. Inconel 625 weld claddings obtained by the GMAW-RE with rotating electrode;The International Journal of Advanced Manufacturing Technology;2024-05-06
3. GMAW process with rotating electrode: an advanced alternative to improve cladding performance;Journal of Adhesion Science and Technology;2023-10-18
4. Investigations on the role of Inconel 82 additions on improving fatigue and corrosion behaviour of gas tungsten arc AISI 316L stainless steel claddings;Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications;2023-10-04
5. Study on Controlling Material Properties of Cladded Layers Using High Temperature and Hybrid Cladding Process;Journal of the Korean Society for Precision Engineering;2023-10-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3